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什么是堆积电介质（BU）膜？
积水化学绝缘增层膜应用参数
NX04H |
NQ07XP |
Next Target |
|
|---|---|---|---|
CTE (25-150°C) [ppm/°C] |
24.5 |
27 |
24 |
CTE (150-240°C) [ppm/°C] |
70 |
94 |
82 |
Dk (5.8GHz) |
3.3 |
3.3 |
3.3 |
Df (5.8GHz) |
0.0090 |
0.0037 |
0.0023 |
Tensile Strength [MPa] |
100 |
105 |
110 |
Young’s Modulus [GPa] |
8 |
10 |
12 |
Tg (DMA) [°C] |
205 |
183 |
183 |
Elongation [%] |
2.4 |
2.6 |
2.6 |
Ra (WYKO) [nm] |
50 |
50 |
50 |
Available Thicknesses [μm] |
> 20 |
> 20 |
> 20 |
Flame Retardant (UL94) |
V0 |
V0 |
( V0 ※yet to be certified) |
Applications |
Package Substrates for CPU, Networking, PCIe Switch devices and more |
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